Thermal Conductive Adhesive Glue

Features:

• Good conductivity and wide temperature range.
• The surface curing time is short, strong adhesion, non-toxic and solvent free..
• Can be applied safely in elastic adhesion, heat dissipation, insulation and encapsulation in electronics, electrical appliances, instruments, LED, heat sinks and other industries.
• Suitable for all kinds of components, LED and heat dissipation devices which need to be bonded directly. It has high strength and fast adhesion effect.

Specifications
Type: Heatsink Plaster
Material: Silicone
Capacity: 5g(1Pc)
Shear Strength: 1.5MPa
Thermal Conductivity: >0.671W/m.k
Surface Curing Time: 10Min/25 ℃
Operating Temperature Range: -60℃ - 200℃

Usage Instructions:
1.When using, directly squeeze this glue onto the surface to adhere and then immediately adhere the 2 components. Also, make sure to put back the glue cap cover immediately.
2.The surface adhesion speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing rate is, the slower the vice versa.
3.Recommended coating thickness: 0.1-0.5mm, the thinner the better.
4.Before use, please clean the surfaces with solvent (such as alcohol) before adhering the components.

Package Includes 

1 x Thermal Conductive Adhesive Glue

Sold by 3D Gadgets Malaysia